Chemical Engineering — 6th Semester Syllabus

Unit 1.0: Industrial Water I

Industrial water: Properties • Uses • Hard & soft water • Hardness: Total hardness • Permanent hardness • Temporary hardness • Units of hardness • Alkalinity • Numerical • Boiler feed water • Scale and sludge formation • Corrosion • Priming and foaming • Caustic embrittlement

Unit 2.0: Industrial Water II

Methods of water softening processes (Principle • Construction • Working and application of the following processes: Lime soda process (cold and hot) • Zeolite process • Ion exchange process

Unit 3.0: Steam and Steam Generators

Steam: Properties • Uses and types of steam • Steam generator: Classification of boilers • Comparison of boilers based on capacity • Fuel • Design and application • Different components of boiler • Construction and working of: Lancashire boiler • Babcock and Wilcox boiler • Function of boiler mountings and accessories • Boiler act: Indian boiler act and duties of boiler inspector

Unit 4.0: Refrigeration

Refrigeration: Concept • Coefficient of performance (COP) • Numerical • Types of primary and secondary refrigerants: Selection criteria of refrigerants • Refrigeration cycle: Reverse Carnot cycle • Vapor compression and absorption cycle

Unit 5.0: Air and Psychrometry

Concept and application of process air and instrument air • Psychrometry: Dry bulb temperature • Wet bulb temperature • Dew point temperature • Adiabatic saturation temperature • Humidity • Specific humidity • Specific volume • Relative humidity • Psychrometric chart • Numericals • Psychrometric process: Humidification and dehumidification • Cooling tower: Principle • Construction and working of induced draft and forced draft

Unit 6.0: Plant Maintenance

Purpose of plant maintenance • Types of maintenance: Preventive maintenance • Predictive maintenance • Corrective maintenance • Routine/scheduled maintenance • Emergency maintenance • Online maintenance and shut down maintenance • Duties and responsibility of plant maintenance department • Online maintenance of chemical equipment like rotameter etc.

Unit 1.0: Introduction to Plant Design

Introduction to plant design • Process design development • Types of plant design • Comparison of different processes by technical factors • Raw materials • By-products • Plant location • Equipment • Time factor and process considerations • Equipment layout diagram (ELD) • CPM & PERT: Principle & objective • Application of CPM & PERT for calculation of time duration

Unit 2.0: Design Considerations

General design considerations • Cost: Concept of cost • Total cost • Fixed cost • Variable cost • Direct • Indirect cost • Asset accounting • Last in first out & first in first out • Cash flow for industrial operations • Demand & supply: Laws related to demand & supply • Demand & supply schedule

Unit 3.0: Cost Estimation

Cash flow for industrial operations: Factors affecting investment and production cost • Capital investments • Estimation of capital investments • Cost indices • Cost factors in capital investment • Organizations for presenting capital investment: Estimates by compartmentalization • Estimation of total product of cost direction • Production costs • Fixed charges • Plant overhead costs • Financing • Interest and investment cost: Types of interests • Nominal and effective interest rates • Continuous interest • Present worth and discount annuities • Cost due to interest on investment • Source of capital

Unit 4.0: Taxes, Insurances

Taxes and insurances: Type of taxes: Federal income taxes • Insurance-types of insurance self-insurance

Unit 5.0: Depreciation

Depreciation: Service life • Salvage value • Present value • Methods for determining depreciation • Single unit and group depreciation

Unit 6.0: Profitability, Alternative Investments and Replacements

Profitability standards • Discounted cash flow • Capitalized cost • Pay out period • Alternative investments • Analysis with small investment increments and replacements • Optimum design and design strategy • Incremental cost • General procedure for determining optimum condition • Comparison of graphical and analytical methods • Optimum production rates • Semi continuous cyclic operation • Fluid dynamics • Mass transfer

Unit 1.0: Introduction to AI & Searching Techniques

Introduction to artificial intelligence • Types of AI and intelligent agents • Breadth-first search • Depth-first search • Hill climbing • And its variations • Heuristic search techniques: Best-first search • A* algorithm • Constraint satisfaction problem • Means-end analysis • Introduction to game playing • Min-max • And alpha-beta pruning algorithms

Unit 2.0: Knowledge Representation

Propositional logic • First-order predicate logic • Resolution principle • Unification • Semantic nets • Conceptual dependencies • Frames • Scripts • And production rules

Unit 3.0: Understanding Natural Languages I

Components and steps of communication • The contrast between formal and natural languages in the context of grammar • Chomsky hierarchy of grammars • Parsing • And semantics • Parsing techniques

Unit 4.0: Understanding Natural Languages II

Context-free and transformational grammar • Recursive and augmented transition networks

Unit 5.0: AI in Decision Making

Utility theory • Utility functions • Decision networks • Sequential decision problems • Partially observable Markov decision process (MDPs) • Game theory • AI solutions for real-time problems using ML

Unit 6.0: AI in Reinforcement Learning

Passive reinforcement learning (RL) and active RL • Generalization in RL • Policy search • Deep reinforcement learning • AI solutions for real-time problems using RL

Unit 1.0: Introduction

Conventional vehicles: Basics of vehicle performance • Vehicle power source characterization • Transmission characteristics • Mathematical models to describe vehicle performance • Introduction to hybrid electric vehicles: History of hybrid and electric vehicles • Social and environmental importance of hybrid and electric vehicles • Impact of modern drive-trains on energy supplies

Unit 2.0: Hybrid Electric Drive-trains

Hybrid electric drive-trains: Basic concept of hybrid traction • Introduction to various hybrid drive-train topologies • Power flow control in hybrid drive-train topologies • Fuel efficiency analysis

Unit 3.0: Electric Drive-trains

Electric drive-trains: Basic concept of electric traction • Introduction to various electric drive-train topologies • Power flow control in electric drive-train topologies • Fuel efficiency analysis • Electric propulsion unit: Introduction to electric components used in hybrid and electric vehicles • Configuration and control of DC motor drives • Configuration and control of induction motor drives • Configuration and control of permanent magnet motor drives • Configuration and control of switch reluctance motor drives • Drive system efficiency

Unit 4.0: Energy Storage

Energy storage: Introduction to energy storage requirements in hybrid and electric vehicles • Battery based energy storage and its analysis • Fuel cell based energy storage and its analysis • Super capacitor based energy storage and its analysis • Flywheel based energy storage and its analysis • Hybridization of different energy storage devices

Unit 5.0: Sizing the drive system

Sizing the drive system: Matching the electric machine and the internal combustion engine (ICE) • Sizing the propulsion motor • Sizing the power electronics • Selecting the energy storage technology • Communications • Supporting subsystems

Unit 6.0: Energy Management Strategies

Energy management strategies: Introduction to energy management strategies used in hybrid and electric vehicles • Classification of different energy management strategies • Comparison of different energy management strategies • Implementation issues of energy management strategies • Case studies: Design of a hybrid electric vehicle (HEV) • Design of a battery electric vehicle (BEV)

Unit 1.0: Introduction to Industrial Automation

Introduction to Industry 4.0 and its components • Need of automation in industries • Principles and strategies of automation • Factory automation • Process automation • Basic elements of an automated system • Structure of industrial automation • Advanced automation functions • Levels of automations • Industrial control systems- Process and discrete system • Types of automation system: Fixed • Programmable • Flexible • Integrated automation and its application • Different systems used for industrial automation: PLC • HMI • SCADA • DCS • Drives • Introduction to Internet of Things (IoT) and Industrial Internet of Things (IIOT) and its application in automation • Role of robots in automation and its components • Fundamentals of automated production lines or transfer lines and its applications

Unit 2.0: Sensors and Input Field Devices

Analog input devices • Electromagnetic relays • Contactors • Motor starters • Manually operated switches • Toggle switch • Pushbutton switch • Knife switch and selector switches • Mechanically operated switches • Limit switch • Temperature switch (Thermostat) • Pressure switch • Level switch and their symbols • Discrete/Digital input devices • Construction and working of sensors • Proximity sensors- Inductive • Capacitive • Optical and ultrasonic • Advanced sensors- Construction and working of temperature sensors- Thermistor • Thermocouple and resistance temperature detector (RTD) • Liquid level sensor -Capacitive and ultrasonic • Force -Strain/Weight sensors • Flow sensors turbine flow sensor • Pressure sensors- Linear variable • Differential transformer (LVDT) • Inclination sensor -Inclinometer • Acceleration sensor- Accelerometer • Angular and linear position sensor

Unit 3.0: Actuators and Output Devices

Introduction to actuators • Classification of actuators • Mechanical actuators -Translational and rotational motion • Kinematic chains • Cams • Gears • Belt and chain drives • Bearings • Hydraulic and pneumatic actuators • Linear and rotary actuators • Single and double acting cylinder • Directional • Process and pressure control valves • Electrical actuators • Electromechanical actuators • Construction • Working and application of stepper motors • AC/DC servo motors • BLDC motor (very brief) • Electrohydraulic actuators-Solenoid valve • Thermal actuators and magnetic actuators • Selection of actuators

Unit 4.0: Other output Devices

Other output devices- Indicators • Alarms • Pilot lights • Buzzers • Valves • Motor starters • Horns and alarms • Stack lights • Control relays • Pumps and fans

Unit 5.0: Control System

Open and closed loop system • Their transfer function • First order and second order system and their output response and parameters • Types of control • On-off • Feed forward • Open loop and closed loop control and transfer function • Controllers in closed loop control • Proportional controller (P controller) • Integral controller (I controller) • Derivative controller (D- controller) • P-I controller • P-D controller • PID controller

Unit 6.0: SCADA and DCS

Introduction • Need • Benefits and typical applications of SCADA and DCS • SCADA architecture • Remote terminal units (RTUs) • Master terminal units • Various SCADA editors • Communication protocols for SCADA • Comparison of SCADA with DCS • Interfacing SCADA system with PLC • Typical connection diagram • Object linking and embedding for process control (OPC) architecture • Creating SCADA screen • HMI for simple object • Steps for linking SCADA object (defining tags and items, creating trends etc.,) with PLC ladder program using OPC • Configuring simple applications using SCADA: Traffic light control • Water distribution • Pipeline control • Power generation • Transmission and distribution etc. • Procedure to maintain the SCADA based PLC system

Unit 1.0: Introduction to Machine Learning and Fundamentals

Introduction to machine learning • Supervised learning • Unsupervised learning • And reinforcement learning • Machine learning basics: Capacity • Over fitting • And under fitting • Hyperparameters and validation sets • Bias & variance

Unit 2.0: Bayesian Concepts and Decision Trees

Bayes theorem • Concept learning • Maximum likelihood classifier • Bayesian belief networks • Decision-trees • Univariate and multivariate decision tree • Network equivalent of decision trees • Overfitting • And evaluation

Unit 3.0: Instant-Based Learning and Support Vector Machines

Logistic regression • Support vector machine (SVM) • Kernel function and kernel SVM • Instant-based learning: k- nearest neighbour • Locally weighted regression • Radial basis functions • Case based learning

Unit 4.0: Clustering

Clustering: k-means • Adaptive hierarchical clustering • And Gaussian mixture model

Unit 5.0: Neural Networks

Neural network: Perception • Multilayer network • Back propagation

Unit 6.0: Applications and Case Studies of Machine Learning

Applications of machine learning (case studies): Business analytics • Natural language processing • Computer vision • Internet of Things • Bio-informatics etc.

Unit 1.0: Introduction to Immersive Technologies

Overview of immersive technologies: Augmented reality (AR) • Virtual reality (VR) • Mixed reality (MR) • And extended reality (XR) • Applications in education • Healthcare • Entertainment • And industry • Key differences between AR • MR and XR • Challenges and future trends

Unit 2.0: Hardware and Software Requirements

AR/VR headsets and displays (e.g. • Oculus • HoloLens • Etc.) • Sensors: Motion • Depth • And tracking systems • Input devices: Controllers • Gloves • And mobile devices • System specifications of central processing unit (CPU) • Graphical processing unit (GPU) • Random access memory (RAM) • Graphics card and storage considerations • AR/VR development platforms (overview): Unity • Unreal Engine • SDKs and APIs for AR • VR: Vuforia • ARKit • ARCore

Unit 3.0: Unity Software

Introduction to Unity software and its features • System requirements for Unity installation • Unity's interface and basic functionalities • Assets and its types • Sources of 2D and 3D assets • Windows in Unity • Game objects and their types • Rigid bodies and colliders • Physics-based interactions • Software development kit (SDK)-Vuforia

Unit 4.0: Augmented Reality (AR)

Principles of AR and its working mechanisms • AR image and object recognition techniques • Location-based and marker-based AR • Introduction to various AR web-based applications • AR design on Blippar or similar platforms • Testing and publishing AR applications

Unit 5.0: AR Design and Development

Anchoring and detecting objects in AR • Development of AR application marker-based and marker less in Unity • Deployment of AR app on Android/iOS devices

Unit 6.0: Virtual Reality (VR)

Principles and technical requirements of virtual reality • Types of VR systems: Non-immersive • Semi-immersive • And fully immersive • Key elements of immersive VR experience • Levels of immersion in VR environment • 360-degree media

Unit 1.0: Introduction to Mems and Microfabrication

History of MEMS development • Characteristics of MEMS • Miniaturization • Microelectronics integration • Mass fabrication with precision • Micro fabrication • Microelectronics fabrication process: Silicon based MEMS processes • New material and fabrication processing • Points of consideration for processing

Unit 2.0: Electrical and Mechanical Properties of Mems Materials

Conductivity of semiconductors • Crystal plane and orientation • Stress and stain: Definition • Relationship between tensile stress and stain • Mechanical properties of silicon and thin films • Flexural beam bending analysis under single loading condition • Types of beam: Deflection of beam • Longitudinal stain under pure bending • Spring constant • Tensional deflection • Intrinsic stress • Resonance and quality factor

Unit 3.0: Sensing and Actuation

Electrostatic sensing and actuation: Parallel plate capacitor • Application-Inertial sensor • Pressure sensor and tactile sensor • Parallel plate actuator and comb drive • Thermal sensing and actuations: Thermal sensors • Thermal actuators • Application-Inertial • Flow and infrared sensors • Piezoresistive sensors: Piezoresistive sensor material • Stress in flexural cantilever and membrane- Application-Inertial • Pressure • Flow and tactile sensor • Piezoelectric sensing and actuation: Piezoelectric material properties-quartz-PZT-PVDF ZnO • Application-Inertial • Acoustic • Tactile • Flow-surface elastic waves • Magnetic actuation: Micro magnetic actuation principle • Deposition of magnetic materials • Design and fabrication of magnetic coil

Unit 4.0: Bulk and Surface Micromachining

Anisotropic wet etching • Dry etching of silicon • Deep reactive ion etching (DRIE) • Isotropic wet etching • Basic surface micromachining process • Structural and sacrificial material • Stiction and anti stiction methods • Foundry process

Unit 5.0: Polymer Mems

Polymers in MEMS • Polymide-SU-8 • Liquid crystal polymer (LCP): PDMS • PMMA • Parylene • Flurocorbon • Application-Acceleration • Pressure • Flow and tactile sensors

Unit 6.0: Optical Mems

Optical MEMS: Refraction • Diffraction • MOEMS components • Digital mirror display (DMD) • Grating light valve (GLV) • Optical scanners

Unit 1.0: Essentials of Electronic Product Design & Packaging

Introduction to electronic product design • Electronic packaging fundamentals • Printed circuit board (PCB) design and fabrication • Thermal • Mechanical • And EMI/EMC considerations • Prototyping • Testing • And reliability

Unit 2.0: Design Aspects of Semiconductor Packaging

Overview of semiconductor packaging types: Dual in-line package (DIP) • QFP • BGA • CSP • And 3D ICs • Wire bonding • Flip-chip • And through-silicon vias (TSVs) • Trends in package miniaturization and integration • Thermal and mechanical design considerations: Heat dissipation in semiconductor packages • Stress and strain due to thermal cycling • Package warpage and delamination issues • Electrical design aspects: Signal integrity and power integrity • Parasitics: resistance • Capacitance • And inductance • High-speed design challenges and mitigation techniques • Materials and substrate technologies: Die attach materials • Encapsulants • And underfills • Organic vs ceramic substrates • Reliability and compatibility of packaging materials • Packaging process flow and testing: Wafer-level packaging and assembly steps • Burn-in • Electrical • And reliability testing • Design for testability (DFT) in semiconductor packaging

Unit 3.0: Dicing & Inspection

Wafer dicing techniques: Mechanical sawing (blade dicing) • Laser dicing and stealth dicing • Plasma dicing (dry etching methods) • Comparison of dicing methods based on precision • Cost • And material type • Dicing process parameters and optimization: Cut depth • Kerf width • And feed rate • Cooling and lubrication during dicing • Minimizing chipping • Cracking • And contamination • Wafer mounting and handling: Use of dicing tapes and frames • Wafer alignment and chucking • ESD precautions and cleanroom requirements • Post-dicing cleaning and debris removal: Cleaning techniques (wet • Dry • CO2 snow) • Particle contamination control • Inspection for surface damage or residues • Wafer inspection and defect analysis: Visual and automated optical inspection (AOI) • Surface and edge defect detection • Use of SEM • X-ray • And infrared imaging for deeper inspection • Yield analysis and defect classification

Unit 4.0: Conventional Packaging

Introduction to conventional packaging types: Dual in-line package (DIP) • Surface mount device (SMD) • Chip-on-board (COB) and leadframe-based packaging • Through-hole vs. surface-mount technologies • Materials used in conventional packaging: Encapsulants and molding compounds • Leadframe materials (e.g. • Copper • Brass • And alloys) • Substrate materials: epoxy • Ceramic • And organic laminates • Packaging assembly processes: Die attach methods: eutectic bonding • Adhesive bonding • Wire bonding techniques: gold • Aluminum • And copper wire • Molding and encapsulation processes • Electrical and thermal design in conventional packaging: Signal integrity in conventional packages • Heat dissipation and thermal management strategies • Thermal cycling and reliability considerations • Testing and reliability of conventional packages: Standard testing methods: electrical • Thermal • And mechanical tests • Reliability testing: accelerated life testing (ALT) • Burn-in tests • Failure analysis techniques: decapsulation • Cross-sectioning

Unit 5.0: Bonding, Sealing

Bonding techniques in semiconductor packaging: Wire bonding (gold • Aluminum • Copper) • Flip-chip bonding and solder bumping • Adhesive bonding and thermo-compression bonding • Laser and ultrasonic bonding methods • Sealing methods in semiconductor packaging: Molding and encapsulation processes • Hermetic sealing and its importance for high-reliability applications • Use of sealing materials: epoxy • Silicone • And elastomers • Advanced sealing techniques for 3D and wafer-level packaging • Reliability and testing in bonding and sealing: Mechanical and thermal stress testing in bonded and sealed packages • Failure analysis methods: decapsulation • Cross-sectioning • And SEM analysis

Unit 6.0: Advanced Packaging

Advanced packaging technologies: System-in-package (SiP) and package-on-package (PoP) technologies • 3D integrated circuits (3D ICs) and through-silicon vias (TSVs) • Wafer-level packaging (WLP) and fan-out wafer-level packaging (FOWLP) • Hybrid and multi-chip module (MCM) integration • Thermal and electrical considerations in advanced packaging: Thermal management techniques in advanced packaging (heat sinks • Thermal vias) • Electrical performance challenges: signal integrity and power delivery in high-density packages • Power dissipation and interconnect strategies in 3D packaging • Reliability testing standards for advanced packaging (e.g. • JEDEC • MIL-STD)

Unit 1.0: Additive Manufacturing Introduction and CAD-CAM for 3D Printing

Additive v/s conventional manufacturing processes • Classification of 3D printing processes • Working principle of various 3D printing processes- Fused deposition modeling (FDM) • Stereo lithography (SLA) • Selective laser sintering (SLS) • Binder jetting • Material jetting • Direct energy deposition and laminate object manufacturing • Additive manufacturing application domains: Aerospace • Electronics • Health care • Defense • Automotive • Construction • Food processing • Machine tools • Product design and prototyping • Reverse engineering for 3D printing • CAD-CAM and its integration • CAD- Part and surface modeling • CAD file formats • Process chain for 3D printing • STL interface specification • STL data generation • STL data manipulation • Advantages and limitations of STL file format • Open files • Repair of STL files • Alternative 3D printing interfaces • Part orientation and support generation • Factors affecting part orientation • Various models for part orientation determination • The function of part supports • Support structure design • Automatic support structure generation • Model slicing and contour data organization • Direct and adaptive slicing: Identification of peak features • Adaptive layer thickness determination • Tool path generation

Unit 2.0: 3D Printing Materials

Various forms of 3D printing raw material- Liquid • Solid • Wire • Powder • Popular FDM • SLA • SLS • Binder jetting • Material jetting and direct energy deposition 3D printing materials • Polymers • Metals • Non-metals • Ceramics • Polymers and their properties • Powder preparation and their desired properties • Choosing the right 3D printing material on the basis of performance requirements and material properties

Unit 3.0: Solid based 3D Printing Processes

Basic principle and working of fused deposition modeling (FDM) process • Construction details and working of established FDM based 3D printers for plastics parts • 3D printer software- Fusion 360 • Solidworks • Onshape • Tinkercad • UltimakerCura • MeshLab • Simplyfy 3D • Repetier host • Slic3r • Etc. use and operation of anyone • 3D scanners and working • Producing a part using FDM based 3D printer • Liquefaction • Solidification and bonding • Laminated object manufacturing process • Cost estimation of FDM 3D printed component

Unit 4.0: Liquid based 3D Printing Processes

Photo polymerization • Principle and working of stereo lithography apparatus • SLA based 3D printing processes • SLA based 3D printing process materials • Scanning techniques • Curing processes • Cost estimation of SLA 3D printed component

Unit 5.0: Powder based 3D Printing Processes

Powder fusion mechanism • Principle and working of selective laser sintering (SLS) process • SLS based 3D printers • Laser engineering net shaping process • Electron beam melting • Binder jet 3D printing • Materials and process parameters for SLS based 3D printing processes • Cost estimation of SLS based 3D printed component

Unit 6.0: Post Processing and Quality

Need of post processing: Functional and aesthetic reasons • Steps of post processing: Cleaning/support removal • Fixing • Curing or hardening • Surface finishing • Colouring • Cleaning: Support removal (FDM and material jetting) • Powder removal (SLS and powder bed fusion) • Washing (SLA and photo polymerisation) • Fixing: Filling • Gluing • Welding • Surface finishing: Sanding • Polishing • Tumbling • Hydro dipping • Epoxy coating • Electro plating • Vapour smoothing-acetone treatment • Colouring • Coating • Priming and painting • Inspection and testing: Digital • Visual • Physical • Defects and their causes