Mining Engineering — 6th Semester Syllabus

Unit-1.0: Introduction

Overview And Objectives Of Mine Planning • Types Of Mine Planning (short-term, Medium-term, Long-term) • Data Requirements: Geological • Geotechnical • Hydrological • Reserve Estimation And Classification • Introduction To Mine Planning Software

Unit-2.0: Underground Coal Mine Planning

Factors Affecting Underground Layout Design • Planning For Board And Pillar And Longwall Mining Method • Panel And Support Designs • Ventilation • And Material Handling Considerations • Underground Mine Production Scheduling And Manpower Planning • Subsidence Prediction And Control

Unit-3.0: Surface Coal Mine Planning

Surface Mine Layout: Pit Design • Bench Parameters • Haul Roads • Stripping Ratio And Pit Optimization • Planning For Dragline • Shovel-dumper Combination And Highwall Mining • Equipment Selection And Capacity • Blasting Design And Scheduling

Unit-4.0: Economic and Strategic Aspects

Mine Planning Economics: CAPEX • OPEX • NPV • IRR • Payback Period • Break-even Analysis And Cost Control • Production Scheduling And Sequencing • Decision-making Under Uncertainty And Sensitivity Analysis • Strategic Mine Planning And Long-term Forecasting

Unit-5.0: Smart and Sustainable Mine Planning I

Planning For Reclamation And Mine Closure • Environmental And Legal Considerations In Coal Mine Planning • Safety • Health And Risk Assessment

Unit-6.0: Smart and Sustainable Mine Planning II

Integration Of Digital Tools: AI • GIS • Remote Sensing • Automation • Case Studies Of Advanced Mine Planning In Indian And International Coal Mines

Unit-1.0: System Engineering and Lineal Programming

Introductory Of Systems Concept • Analysis And Systems Engineering • Basic Concepts Of Statistical Decision Theory • Mathematical Formulation And Standard Form • Linear Programming Problems (LPPs) • Graphical And Simplex Methods

Unit-2.0: Advanced Operations Research Techniques and Applications in Mining Systems

Variants Of Simplex Algorithm And Duality In Linear Programming • Simulation Techniques-Simulation For Equipment Selection And Production Scheduling • Management Information Systems (MIS) In Mining • Inventory Models And Transportation Problems

Unit-3.0: Transportation Problem

Definition And Structure Of Transportation Problems • Methods For Finding Basic Feasible Solution (BFS) • Unbalanced Transportation Problem • Applications Of Transportation Problems • Formulation Of Assignment Problem

Unit-4.0: Mining Project Planning and Scheduling Using Network Techniques

Definition Of Project Networks • Network Techniques For Mining Projects- Application Of Network Analysis In Mining Projects • PERT- Calculation Of Expected Project Duration • Project Variance And Standard Deviation • Its Application In Mining Projects • CPM- Elements Of Crashing • Least Cost Project Scheduling • Flow In Networks- Shortest Route Problems • Maximum Flow Problems

Unit-5.0: Queuing Theory

Queuing Theory: Queuing System And Their Characteristics • The M/M/I Queuing System

Unit-6.0: Game Theory

Game Theory: Formulation Of Games • Two Person - Zero Sum Game • Games With And Without Saddle Point • Graphical Solution (2xn, Mx2game)

Unit-1.0: Introduction

Scope • Objectives And Limitations Of Ore/Mineral Processing • Terminologies • Beneficiation • Mineral Beneficiation And Its Sequence Of Operations • Economic Justifications • Ore Sorting – Hand Mechanical • Electronic • Ore Transportation

Unit-2.0: Commination and Liberation

Liberation: Concept • Importance And Measurements Of Liberation • Commination: Fracture • Laws • Objectives And Types Of Comminations • Crushing: Crushing Operations • Open And Closed-circuit Operations • Types Of Crushers • Grinding: Wet And Dry Grinding • Grinding Circuits • And Types Of Mills

Unit-3.0: Sizing and Classification

Laws Of Settling Of Solids In Fluid • Laboratory Size Analysis And Interpretation • Laboratory Method Of Sizing And Data Interpretation • Industrial Sizing By Screens • Types And Performance Of Classifiers And Factors Affecting Them • Mechanical Classifiers And Hydro Cyclones

Unit-4.0: Separations / Concentration

Gravity Concentration Methods: Jigging • Heavy Media Separation • Flowing Film Concentration Theory • Application And Limitations • Froth Flotation: Physico-chemical Principles • Reagents • Machines • Flotation Of Sulphides • Oxides And Coal • Electrical And Magnetic Methods Of Concentration: Principles • Types • Fields Of Application And Limitations • Dewatering And Drying: Principles And Techniques • Thickening • Filtration • And Drying Techniques

Unit-5.0: Plant Practice, Simplified Flow Sheets

Plant Practices: Locations • Layouts And Selection Of Equipment • Simplified Flow Sheets: Beneficiation Of Coal • Copper • Aluminium • Lead • Zinc • Iron • Silver • Gold • Uranium • Manganese • Limestone Reference To Indian Deposit

Unit-6.0: Environmental Issues

Environmental Issue: Drying And Disposal Of Tailing • Associated Environmental Problems And Their Control • Utilization Of Waste Disposals

Unit-1.0: Introduction to AI & Searching Techniques

Introduction To Artificial Intelligence • Types Of AI And Intelligent Agents • Breadth-first Search • Depth-first Search • Hill Climbing • And Its Variations • Heuristic Search Techniques: Best-first Search • A* Algorithm • Constraint Satisfaction Problem • Means-end Analysis • Introduction To Game Playing • Min-max • And Alpha-beta Pruning Algorithms

Unit-2.0: Knowledge Representation

Propositional Logic • First-Order Predicate Logic • Resolution Principle • Unification • Semantic Nets • Conceptual Dependencies • Frames • Scripts • And Production Rules

Unit-3.0: Understanding Natural Languages I

Components And Steps Of Communication • The Contrast Between Formal And Natural Languages In The Context Of Grammar • Chomsky Hierarchy Of Grammars • Parsing • And Semantics • Parsing Techniques

Unit-4.0: Understanding Natural Languages II

Context-Free And Transformational Grammar • Recursive And Augmented Transition Networks

Unit-5.0: AI in Decision Making

Utility Theory • Utility Functions • Decision Networks • Sequential Decision Problems • Partially Observable Markov Decision Process (MDPs) • Game Theory • AI Solutions For Real-time Problems Using ML

Unit-6.0: AI in Reinforcement Learning

Passive Reinforcement Learning (RL) And Active RL • Generalization In RL • Policy Search • Deep Reinforcement Learning • AI Solutions For Real-time Problems Using RL

Unit-1.0: Introduction

Conventional Vehicles: Basics Of Vehicle Performance • Vehicle Power Source Characterization • Transmission Characteristics • Mathematical Models To Describe Vehicle Performance • Introduction To Hybrid Electric Vehicles: History Of Hybrid And Electric Vehicles • Social And Environmental Importance Of Hybrid And Electric Vehicles • Impact Of Modern Drive-trains On Energy Supplies

Unit-2.0: Hybrid Electric Drive-trains

Hybrid Electric Drive-trains: Basic Concept Of Hybrid Traction • Introduction To Various Hybrid Drive- Train Topologies • Power Flow Control In Hybrid Drive-train Topologies • Fuel Efficiency Analysis

Unit-3.0: Electric Trains

Electric Drive-trains: Basic Concept Of Electric Traction • Introduction To Various Electric Drive-train Topologies • Power Flow Control In Electric Drive-train Topologies • Fuel Efficiency Analysis • Electric Propulsion Unit: Introduction To Electric Components Used In Hybrid And Electric Vehicles • Configuration And Control Of DC Motor Drives • Configuration And Control Of Induction Motor Drives • Configuration And Control Of Permanent Magnet Motor Drives • Configuration And Control Of Switch Reluctance Motor Drives • Drive System Efficiency

Unit-4.0: Energy Storage

Energy Storage: Introduction To Energy Storage Requirements In Hybrid And Electric Vehicles • Battery Based Energy Storage And Its Analysis • Fuel Cell Based Energy Storage And Its Analysis • Super Capacitor Based Energy Storage And Its Analysis • Flywheel Based Energy Storage And Its Analysis • Hybridization Of Different Energy Storage Devices

Unit-5.0: Sizing the drive system

Sizing The Drive System: Matching The Electric Machine And The Internal Combustion Engine (ICE) • Sizing The Propulsion Motor • Sizing The Power Electronics • Selecting The Energy Storage Technology • Communications • Supporting Subsystems

Unit-6.0: Energy Management Strategies

Energy Management Strategies: Introduction To Energy Management Strategies Used In Hybrid And Electric Vehicles • Classification Of Different Energy Management Strategies • Comparison Of Different Energy Management Strategies • Implementation Issues Of Energy Management Strategies • Case Studies: Design Of A Hybrid Electric Vehicle (HEV) • Design Of A Battery Electric Vehicle (BEV)

Unit-1.0: Introduction to Industrial Automation

Introduction To Industry 4.0 And Its Components • Need Of Automation In Industries • Principles And Strategies Of Automation • Factory Automation • Process Automation • Basic Elements Of An Automated System • Structure Of Industrial Automation • Advanced Automation Functions • Levels Of Automations • Industrial Control Systems- Process And Discrete System • Types Of Automation System: Fixed • Programmable • Flexible • Integrated Automation And Its Application • Different Systems Used For Industrial Automation: PLC • HMI • SCADA • DCS • Drives • Introduction To Internet Of Things (IoT) And Industrial Internet Of Things (IIOT) And Its Application In Automation • Role Of Robots In Automation And Its Components • Fundamentals Of Automated Production Lines Or Transfer Lines And Its Applications

Unit-2.0: Sensors and Input Field Devices

Analog Input Devices Electromagnetic Relays • Contactors • Motor Starters • Manually Operated Switches Toggle Switch • Pushbutton Switch • Knife Switch And Selector Switches • Mechanically Operated Switches Limit Switch • Temperature Switch (Thermostat) • Pressure Switch • Level Switch And Their Symbols • Discrete/Digital Input Devices • Construction And Working Of Sensors • Proximity Sensors- Inductive • Capacitive • Optical And Ultrasonic • Advanced Sensors-Construction And Working Of Temperature Sensors- Thermistor • Thermocouple And Resistance Temperature Detector (RTD) • Liquid Level Sensor -Capacitive And Ultrasonic • Force -Strain/Weight Sensors • Flow Sensors – Turbine Flow Sensor • Pressure Sensors- Linear Variable • Differential Transformer (LVDT) • Inclination Sensor –Inclinometer • Acceleration Sensor- Accelerometer • Angular And Linear Position Sensor

Unit-3.0: Actuators and Output Devices

Introduction To Actuators • Classification Of Actuators • Mechanical Actuators -Translational And Rotational Motion • Kinematic Chains • Cams • Gears • Belt And Chain Drives • Bearings • Hydraulic And Pneumatic Actuators Linear And Rotary Actuators • Single And Double Acting Cylinder • Directional • Process And Pressure Control Valves • Electrical Actuators • Electromechanical Actuators • Construction • Working And Application Of Stepper Motors • AC/DC Servo Motors • BLDC Motor (Very Brief) • Electrohydraulic Actuators-Solenoid Valve • Thermal Actuators And Magnetic Actuators • Selection Of Actuators

Unit-4.0: Other output Devices

Other Output Devices- Indicators • Alarms Pilot Lights • Buzzers • Valves • Motor Starters • Horns And Alarms • Stack Lights Control Relays • Pumps And Fans

Unit-5.0: Control System

Open And Closed Loop System • Their Transfer Function • First Order And Second Order System And Their Output Response And Parameters • Types Of Control – On-off • Feed Forward • Open Loop And Closed Loop Control And Transfer Function • Controllers In Closed Loop Control • Proportional Controller (P Controller) • Integral Controller (I Controller) • Derivative Controller (D- Controller) • P-I Controller • P-D Controller • PID Controller

Unit-6.0: SCADA and DCS

Introduction • Need • Benefits And Typical Applications Of SCADA And DCS • SCADA Architecture - Remote Terminal Units (RTUs) • Master Terminal Units • Various SCADA Editors • Communication Protocols For SCADA • Comparison Of SCADA With DCS • Interfacing SCADA System With PLC Typical Connection Diagram • Object Linking And Embedding For Process Control (OPC) Architecture • Creating SCADA Screen HMI For Simple Object • Steps For Linking SCADA Object (defining Tags And Items, Creating Trends Etc..) With PLC Ladder Program Using OPC • Configuring Simple Applications Using SCADA: Traffic Light Control • Water Distribution • Pipeline Control • Power Generation • Transmission And Distribution Etc. • Procedure To Maintain The SCADA Based PLC System

Unit-1.0: Introduction to Machine Learning and Fundamentals

Introduction To Machine Learning • Supervised Learning • Unsupervised Learning • And Reinforcement Learning • Machine Learning Basics: Capacity • Over Fitting • And Under Fitting • Hyperparameters And Validation Sets • Bias & Variance

Unit-2.0: Bayesian Concepts and Decision Trees

Bayes Theorem Concept Learning Maximum Likelihood Classifier • Bayesian Belief Networks • Decision-trees • Univariate And Multivariate Decision Tree • Network Equivalent Of Decision Trees • Overfitting • And Evaluation

Unit-3.0: Instant-Based Learning and Support Vector Machines

Logistic Regression • Support Vector Machine (SVM) • Kernel Function And Kernel SVM • Instant-based Learning: K- Nearest Neighbour • Locally Weighted Regression • Radial Basis Functions • Case Based Learning

Unit-4.0: Clustering

Clustering: K-means • Adaptive Hierarchical Clustering • And Gaussian Mixture Model

Unit-5.0: Neural Networks

Neural Network: Perception • Multilayer Network • Back Propagation

Unit-6.0: Applications and Case Studies of Machine Learning

Applications Of Machine Learning (Case Studies): Business Analytics • Natural Language Processing • Computer Vision • Internet Of Things • Bio-informatics Etc.

Unit-1.0: Introduction to Immersive Technologies

Overview Of Immersive Technologies: Augmented Reality (AR) • Virtual Reality (VR) • Mixed Reality (MR) • And Extended Reality (XR) • Applications In Education • Healthcare • Entertainment • And Industry • Key Differences Between AR • MR And XR • Challenges And Future Trends

Unit-2.0: Hardware and Software Requirements

AR/VR Headsets And Displays (e.g., Oculus, HoloLens, Etc.) • Sensors: Motion • Depth • And Tracking Systems • Input Devices: Controllers • Gloves • And Mobile Devices • System Specifications Of Central Processing Unit (CPU) • Graphical Processing Unit (GPU) • Random Access Memory (RAM) • Graphics Card And Storage Considerations • AR/VR Development Platforms (overview): Unity • Unreal Engine • SDKs And APIs For AR • VR: Vuforia • ARKit • ARCore

Unit-3.0: Unity Software

Introduction To Unity Software And Its Features • System Requirements For Unity Installation • Unity's Interface And Basic Functionalities • Assets And Its Types • Sources Of 2D And 3D Assets • Windows In Unity • Game Objects And Their Types • Rigid Bodies And Colliders • Physics-Based Interactions • Software Development Kit (SDK)-Vuforia

Unit-4.0: Augmented Reality (AR)

Principles Of AR And Its Working Mechanisms • AR Image And Object Recognition Techniques • Location-based And Marker-based AR • Introduction To Various AR Web-based Applications • AR Design On Blippar Or Similar Platforms • Testing And Publishing AR Applications

Unit-5.0: AR Design and Development

Anchoring And Detecting Objects In AR • Development Of AR Application Marker-based And Marker Less In Unity • Deployment Of AR App On Android/iOS Devices

Unit-6.0: Virtual Reality (VR)

Principles And Technical Requirements Of Virtual Reality • Types Of VR Systems: Non-immersive • Semi-immersive • And Fully Immersive • Key Elements Of Immersive VR Experience • Levels Of Immersion In VR Environment • 360-degree Mediaso3.1

Unit-1.0: Introduction to Mems and Microfabrication

History Of MEMS Development • Characteristics Of MEMS • Miniaturization • Microelectronics Integration • Mass Fabrication With Precision • Micro Fabrication • Microelectronics Fabrication Process: Silicon Based MEMS Processes • New Material And Fabrication Processing • Points Of Consideration For Processing

Unit-2.0: Electrical and Mechanical Properties of Mems Materials

Conductivity Of Semiconductors • Crystal Plane And Orientation • Stress And Stain: Definition • Relationship Between Tensile Stress And Stain • Mechanical Properties Of Silicon And Thin Films • Flexural Beam Bending Analysis Under Single Loading Condition • Types Of Beam: Deflection Of Beam • Longitudinal Stain Under Pure Bending • Spring Constant • Tensional Deflection • Intrinsic Stress • Resonance And Quality Factor

Unit-3.0: Sensing and Actuation

Electrostatic Sensing And Actuation: Parallel Plate Capacitor • Application-Inertial Sensor • Pressure Sensor And Tactile Sensor • Parallel Plate Actuator And Comb Drive • Thermal Sensing And Actuations: Thermal Sensors • Thermal Actuators • Application-Inertial • Flow And Infrared Sensors • Piezoresistive Sensors: Piezoresistive Sensor Material • Stress In Flexural Cantilever And Membrane- Application-Inertial • Pressure • Flow And Tactile Sensor • Piezoelectric Sensing And Actuation:- Piezoelectric Material Properties-quartz-PZT-PVDF – ZnO • Application-Inertial • Acoustic • Tactile • Flow-surface Elastic Waves • Magnetic Actuation:- Micro Magnetic Actuation Principle • Deposition Of Magnetic Materials • Design And Fabrication Of Magnetic Coil

Unit-4.0: Bulk and Surface Micromachining

Anisotropic Wet Etching • Dry Etching Of Silicon • Deep Reactive Ion Etching (DRIE) • Isotropic Wet Etching • Basic Surface Micromachining Process • Structural And Sacrificial Material • Stiction And Anti Stiction Methods • Foundry Process

Unit-5.0: Polymer Mems

Polymers In MEMS • Polymide-SU-8 • Liquid Crystal Polymer (LCP): PDMS • PMMA • Parylene • Flurocorbon • Application-Acceleration • Pressure • Flow And Tactile Sensors

Unit-6.0: Optical Mems

Optical MEMS: - Refraction • Diffraction • MOEMS Components • Digital Mirror Display (DMD) • Grating Light Valve (GLV) • Optical Scanners

Unit-1.0: Essentials of Electronic Product Design & Packaging

Introduction To Electronic Product Design • Electronic Packaging Fundamentals • Printed Circuit Board (PCB) Design And Fabrication • Thermal • Mechanical • And EMI/EMC Considerations • Prototyping • Testing • And Reliability

Unit-2.0: Design Aspects of Semiconductor Packaging

Overview Of Semiconductor Packaging Types: Dual In-line Package (DIP) • QFP • BGA • CSP • And 3D ICs • Wire Bonding • Flip-chip • And Through-silicon Vias (TSVs) • Trends In Package Miniaturization And Integration • Thermal And Mechanical Design Considerations: Heat Dissipation In Semiconductor Packages • Stress And Strain Due To Thermal Cycling • Package Warpage And Delamination Issues • Electrical Design Aspects: Signal Integrity And Power Integrity • Parasitics: Resistance • Capacitance • And Inductance • High-speed Design Challenges And Mitigation Techniques • Materials And Substrate Technologies: Die Attach Materials • Encapsulants • And Underfills • Organic Vs Ceramic Substrates • Reliability And Compatibility Of Packaging Materials • Packaging Process Flow And Testing: Wafer-level Packaging And Assembly Steps • Burn-in • Electrical • And Reliability Testing • Design For Testability (DFT) In Semiconductor Packaging

Unit-3.0: Dicing & Inspection

Wafer Dicing Techniques: Mechanical Sawing (Blade Dicing) • Laser Dicing And Stealth Dicing • Plasma Dicing (Dry Etching Methods) • Comparison Of Dicing Methods Based On Precision • Cost • And Material Type • Dicing Process Parameters And Optimization: Cut Depth • Kerf Width • And Feed Rate • Cooling And Lubrication During Dicing • Minimizing Chipping • Cracking • And Contamination • Wafer Mounting And Handling: Use Of Dicing Tapes And Frames • Wafer Alignment And Chucking • ESD Precautions And Cleanroom Requirements • Post-Dicing Cleaning And Debris Removal: Cleaning Techniques (Wet, Dry, CO₂ Snow) • Particle Contamination Control • Inspection For Surface Damage Or Residues • Wafer Inspection And Defect Analysis: Visual And Automated Optical Inspection (AOI) • Surface And Edge Defect Detection • Use Of SEM • X-ray • And Infrared Imaging For Deeper Inspection • Yield Analysis And Defect Classification

Unit-4.0: Conventional Packaging

Introduction To Conventional Packaging Types: Dual In-line Package (DIP) • Surface Mount Device (SMD) • Chip-on-Board (COB) And Leadframe-based Packaging • Through-hole Vs. Surface-mount Technologies • Materials Used In Conventional Packaging: Encapsulants And Molding Compounds • Leadframe Materials (e.g., Copper, Brass, And Alloys) • Substrate Materials: Epoxy • Ceramic • And Organic Laminates • Packaging Assembly Processes: Die Attach Methods: Eutectic Bonding • Adhesive Bonding • Wire Bonding Techniques: Gold • Aluminum • And Copper Wire • Molding And Encapsulation Processes • Electrical And Thermal Design In Conventional Packaging: Signal Integrity In Conventional Packages • Heat Dissipation And Thermal Management Strategies • Thermal Cycling And Reliability Considerations • Testing And Reliability Of Conventional Packages: Standard Testing Methods: Electrical • Thermal • And Mechanical Tests • Reliability Testing: Accelerated Life Testing (ALT) • Burn-in Tests • Failure Analysis Techniques: Decapsulation • Cross-sectioning

Unit-5.0: Bonding, Sealing

Bonding Techniques In Semiconductor Packaging: Wire Bonding (Gold, Aluminum, Copper) • Flip-chip Bonding And Solder Bumping • Adhesive Bonding And Thermo-compression Bonding • Laser And Ultrasonic Bonding Methods • Sealing Methods In Semiconductor Packaging: Molding And Encapsulation Processes • Hermetic Sealing And Its Importance For High-reliability Applications • Use Of Sealing Materials: Epoxy • Silicone • And Elastomers • Advanced Sealing Techniques For 3D And Wafer-level Packaging • Reliability And Testing In Bonding And Sealing: Mechanical And Thermal Stress Testing In Bonded And Sealed Packages • Failure Analysis Methods: Decapsulation • Cross-sectioning • And SEM Analysis

Unit-6.0: Advanced Packaging

Advanced Packaging Technologies: System-in-Package (SiP) And Package-on-Package (PoP) Technologies • 3D Integrated Circuits (3D ICs) And Through-Silicon Vias (TSVs) • Wafer-Level Packaging (WLP) And Fan-Out Wafer-Level Packaging (FOWLP) • Hybrid And Multi-Chip Module (MCM) Integration • Thermal And Electrical Considerations In Advanced Packaging: Thermal Management Techniques In Advanced Packaging (Heat Sinks, Thermal Vias) • Electrical Performance Challenges: Signal Integrity And Power Delivery In High-density Packages • Power Dissipation And Interconnect Strategies In 3D Packaging • Reliability Testing Standards For Advanced Packaging (e.g., JEDEC, MIL-STD)

Unit-1.0: Additive Manufacturing Introduction and CAD-CAM for 3D Printing

Additive V/s Conventional Manufacturing Processes • Classification Of 3D Printing Processes • Working Principle Of Various 3D Printing Processes- Fused Deposition Modeling (FDM) • Stereo Lithography (SLA) • Selective Laser Sintering (SLS) • Binder Jetting • Material Jetting • Direct Energy Deposition And Laminate Object Manufacturing • Additive Manufacturing Application Domains: Aerospace • Electronics • Health Care • Defense • Automotive • Construction • Food Processing • Machine Tools • Product Design And Prototyping • Reverse Engineering For 3D Printing • CAD-CAM And Its Integration • CAD- Part And Surface Modeling • CAD File Formats • Process Chain For 3D Printing • STL Interface Specification • STL Data Generation • STL Data Manipulation • Advantages And Limitations Of STL File Format • Open Files • Repair Of STL Files • Alternative 3D Printing Interfaces • Part Orientation And Support Generation • Factors Affecting Part Orientation • Various Models For Part Orientation Determination • The Function Of Part Supports • Support Structure Design • Automatic Support Structure Generation • Model Slicing And Contour Data Organization • Direct And Adaptive Slicing: Identification Of Peak Features • Adaptive Layer Thickness Determination • Tool Path Generation

Unit-2.0: 3D Printing Materials

Various Forms Of 3D Printing Raw Material- Liquid • Solid • Wire • Powder • Popular FDM • SLA • SLS • Binder Jetting • Material Jetting And Direct Energy Deposition 3D Printing Materials • Polymers • Metals • Non-Metals • Ceramics • Polymers And Their Properties • Powder Preparation And Their Desired Properties • Choosing The Right 3D Printing Material On The Basis Of Performance Requirements And Material Properties

Unit-3.0: Solid based 3D Printing Processes

Basic Principle And Working Of Fused Deposition Modeling (FDM) Process • Construction Details And Working Of Established FDM Based 3D Printers For Plastics Parts • 3D Printer Software- Fusion 360 • Solidworks • Onshape • Tinkercad • UltimakerCura • MeshLab • Simplyfy 3D • Repetier Host • Slic3r, Etc. – Use And Operation Of Anyone • 3D Scanners And Working • Producing A Part Using FDM Based 3D Printer • Liquefaction • Solidification And Bonding • Laminated Object Manufacturing Process • Cost Estimation Of FDM 3D Printed Component

Unit-4.0: Liquid based 3D Printing Processes

Photo Polymerization • Principle And Working Of Stereo Lithography Apparatus • SLA Based 3D Printing Processes • SLA Based 3D Printing Process Materials • Scanning Techniques • Curing Processes • Cost Estimation Of SLA 3D Printed Component

Unit-5.0: Powder based 3D Printing Processes

Powder Fusion Mechanism • Principle And Working Of Selective Laser Sintering (SLS) Process • SLS Based 3D Printers • Laser Engineering Net Shaping Process • Electron Beam Melting • Binder Jet 3D Printing • Materials And Process Parameters For SLS Based 3D Printing Processes • Cost Estimation Of SLS Based 3D Printed Component

Unit-6.0: Post Processing and Quality

Need Of Post Processing: Functional And Aesthetic Reasons • Steps Of Post Processing: Cleaning/Support Removal • Fixing • Curing Or Hardening • Surface Finishing • Colouring • Cleaning: Support Removal (FDM And Material Jetting) • Powder Removal (SLS And Powder Bed Fusion) • Washing (SLA And Photo Polymerisation) • Fixing: Filling • Gluing • Welding • Surface Finishing: Sanding • Polishing • Tumbling • Hydro Dipping • Epoxy Coating • Electro Plating • Vapour Smoothing-Acetone Treatment • Colouring • Coating • Priming And Painting • Inspection And Testing: Digital • Visual • Physical • Defects And Their Causes